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STIP Presentation: Sustainability and Packaging at Apple

April 19 @ 2:15 pm - 3:15 pm

The Science and Engineering Intensive Path will host Kate Bergeron, VP Hardware Engineering, S.B., MIT, M.Sc., Mechanical Engineering, University of Colorado, Boulder, MBA and Connie Yang from Apple Computer in a conversation on sustainability and packaging. Attendance is required for STIP students. All others are welcome. Room 221.


April 19
2:15 pm - 3:15 pm
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